Fabrication of W-Cu functionally graded materials with high density by particle size adjustment and solid state hot press

Composites Science and Technology

Volumn 68, Issue 6, 2008, Pages 1539-1547

  Liu, Bin Bin ^a   Xie, Jian Xin ^a   Qu, Xuan Hui ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

Author keywords

A. Metal matrix composite (MMC); D. Scanning electron microscopy (SEM); E. Powder processing; E. Sintering; Particle size adjustment

Indexed keywords

COPPER; FUNCTIONALLY GRADED MATERIALS; HOT PRESSING; PARTICLE SIZE ANALYSIS; POWDER METALS; SCANNING ELECTRON MICROSCOPY; SINTERING; TUNGSTEN;

DENSE MICROSTRUCTURE; HOLDING TIME; PARTICLE SIZE ADJUSTMENT;

METALLIC MATRIX COMPOSITES;

COMPOSITE; DENSITY; PARTICLE SIZE; SINTERING;

EID: 40649115235     PISSN: 02663538     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compscitech.2007.10.023     Document Type: Article

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