Finite-element analysis of ceramic multilayer capacitors: Failure probability caused by wave soldering and bending loads

Journal of the American Ceramic Society

Volumn 83, Issue 6, 2000, Pages 1433-1440

  Franken, Klaus ^a   Maier, Horst R ^a   Prume, Klaus ^a   Waser, Rainer ^a,b  

^a RWTH AACHEN UNIVERSITY   (Germany)

^b FORSCHUNGSZENTRUM JÜLICH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (DEFORMATION); ELECTRODES; FAILURE ANALYSIS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; MICROSTRUCTURE; MULTILAYERS; PROBABILITY; RESIDUAL STRESSES; SOLDERING; STRESS ANALYSIS; THERMAL EFFECTS;

WAVE SOLDERING; WEIBULL PARAMETERS;

CERAMIC CAPACITORS;

EID: 0033715554     PISSN: 00027820     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1151-2916.2000.tb01407.x     Document Type: Article

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