Tchnology of niobium oxide capacitor

Advancing Microelectronics

Volumn 31, Issue 3, 2004, Pages 6-10

  Zednicek, T ^a   Zednicek, S ^a   Sita, Z ^a   McCracken, C ^b   Millman, W A ^b   Gill, J ^b  

^a AVX Czech Republic   (Czech Republic)

^b AVX Limited   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

COSTS; ELECTRIC LOADS; ELECTRIC RESISTANCE; NICKEL COMPOUNDS; POWDER METALS; SOLID ELECTROLYTES; TANTALUM;

LOAD RESISTANCE; NIOBIUM OXIDE CAPACITORS; SOLID ELECTROLYTE CAPACITORS;

CAPACITORS;

EID: 25144524710     PISSN: None     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (5)

1. Niobium release, 293DN scries, www.vishay.com
2. Niobium volume production news, www.cpcos.com
3. T. Zednicek, WA. Millman, J. Gill,"Solution for Increasing Capacitance Demand - High CV Tantalum,"CARTS EUROPE 2000, Brussels, Belgium, pp 188-192.
4. J. Cain,"Comparison of Multilayer Ceramic and Tantalum Capacitors,"AVX Technical Publication, AVX Corporation.
5. T. Zednicek & col.,"Leadfree soldering effect to tantalum capacitors," CARTS EUROPE 2001.