Effects of lead-free solders on flex performance

CARTS USA 2005

Volumn , Issue , 2005, Pages 97-101

  Long, Bill ^a   Prevallet, Mike ^a   Prymak, John ^a  

^a KEMET ELECTRONICS CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC BODIES; CUSTOMER CONCERNS; FAILURE RATE; FLEX CRACKS; LEAD FREE SOLDERS; LEAD-BASED SOLDERS; LEAD-FREE SOLDERING; OVERALL FAILURE;

CERAMIC CAPACITORS; CERAMIC MATERIALS; CRACKS; SOLDERING; SURFACE MOUNT TECHNOLOGY;

FAILURE ANALYSIS;

EID: 84878075627     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. J. Bergenthal, J. Prymak, "Capacitance Monitoring While Flex Testing," KEMET Engineering Bulletin F-2110. June 1995.
2. th Capacitor and Resistor Technology Symposium, p. 101 (2004)
3. J. Berganthal, "Ceramic Chip Capacitors "Flex Cracks": Understanding Solution," KEMET Engineering Bulletin F2111. January, 1998
4. MuRata Manufacturing Co., Ltd, "Chip Type Monolithic Ceramic Capacitor Bending Strength Technical Data," issued 1994