Effect of current density and plating time on the morphology of copper electrodeposits on an AFM tip

Journal of the Electrochemical Society

Volumn 155, Issue 4, 2008, Pages

  Lin, K L ^a   Chen, S Y ^a   Mohanty, U S ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; COPPER; CURRENT DENSITY; PHOTORESISTS; POLYMETHYL METHACRYLATES; SCANNING ELECTRON MICROSCOPY;

PLATING TIME;

ELECTRODEPOSITION;

EID: 40549090634     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2832653     Document Type: Article

References (22)

1. K. Franaszczuk and J. Sobokowshi, Surf. Sci. SUSCAS 0039-6028 10.1016/0039-6028(88)90232-4, 204, 530 (1988).
2. A. J. Arvia, R. C. Salvarezza, and W. E. Triaca, Electrochim. Acta ELCAAV 0013-4686 10.1016/0013-4686(89)87138-5, 34, 1057 (1989).
3. N. M. Markovic and P. N. Ross, Jr., J. Vac. Sci. Technol. A JVTAD6 0734-2101 10.1116/1.578352, 11, 2225 (1993).
4. A. Damjanovic, T. H. V. Setty, and J. O'M. Bockris, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.2423989, 113, 429 (1966).
5. M. H. J. Hottenhuis, A. L. M. VanderBerg, and J. P. Vanden Erden, Electrochim. Acta ELCAAV 0013-4686 10.1016/0013-4686(88)80222-6, 33, 1519 (1988).
6. R. Sonnenfeld and P. K. Hansma, Science SCIEAS 0036-8075 10.1126/science.232.4747.211, 232, 211 (1986).
7. O. M. Magnussen, J. Holts, R. J. Nichols, D. M. Kolb, and R. J. Behm, Phys. Rev. Lett. PRLTAO 0031-9007 10.1103/PhysRevLett.64.2929, 64, 2929 (1990).
8. T. Hachiya, H. Honbo, and K. J. Itaya, J. Electroanal. Chem. Interfacial Electrochem. JEIEBC 0022-0728 10.1016/0022-0728(91)80076-3, 315, 275 (1991).
9. S. L. Yau, X. Gao, S. C. Chang, B. C. Schardt, and M. J. Weaver, J. Am. Chem. Soc. JACSAT 0002-7863 10.1021/ja00016a018, 113, 6049 (1991).
10. S. Manne, P. K. Hansma, J. Massie, V. B. Elings, and A. A. Gewirth, Science, 251, 183 (1991). 0036-8075
11. C. H. Chen, S. M. Vescky, and A. A. Gewirth, J. Am. Chem. Soc. JACSAT 0002-7863 10.1021/ja00028a009, 114, 451 (1992).
12. C. H. Chen and A. A. Gewirth, Phys. Rev. Lett. PRLTAO 0031-9007 10.1103/PhysRevLett.68.1571, 68, 1571 (1992).
13. K. Uosaki and M. Koinuma, J. Electroanal. Chem. JECHES 0022-0728 10.1016/0022-0728(93)80387-W, 357, 301 (1993).
14. M. Koinuma and K. Uosaki, J. Vac. Sci. Technol. B JVTBD9 1071-1023 10.1116/1.587282, 12, 1543 (1994).
15. C. X. Fu, W. X. Shen, and T. T. Yao, Physical Chemistry, 4th ed., p. 603, Higher Education Press, Beijing (1990).
16. E. Budevski, G. Staikov, and W. Lorentz, An Introduction to Initial Stages of Metal Deposition, p. 4, Wiley VCH, Weinheim, Germany (1996).
17. A. Milchev, Electrochim. Acta ELCAAV 0013-4686 10.1016/S0013-4686(96) 00314-3, 42, 1533 (1997).
18. J. Kelber, S. Rudenja, and C. Bjelkevig, Electrochim. Acta, 51, 3086 (2006). 0013-4686
19. M. P. Pardave, M. T. Ramirez, I. Gonzalez, and B. R. Scharfiker, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.1393234, 147, 567 (2000).
20. E. Balaur, T. Djenizian, R. Boukherroub, J. N. Chazalviel, F. Ozanam, and P. Schmuki, Electrochem. Commun. ECCMF9 1388-2481 10.1016/j.elecom.2003.11.004, 6, 153 (2004).
21. T. Djenizian and P. Schmuki, J. Electroceram. JOELFJ 1385-3449 10.1007/s10832-006-0902-1, 16, 9 (2006).
22. T. Djenizian, L. Santinaeci, and P. Schmuki, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.1348258, 148, C197 (2001).