Package and chip design optimization for mid-frequency power distribution decoupling

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn 2002-January, Issue , 2002, Pages 245-248

  Garben, Bernd ^a   Katopis, George A ^b   Becker, Wiren D ^b  

^a IBM   (Germany)

^b IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; ELECTRIC POWER SYSTEMS; ELECTRONICS PACKAGING; PACKAGING;

CHIP DESIGN; DECOUPLING CAPACITOR; DELTA-I; MID-FREQUENCIES; ON CHIPS; PACKAGE DESIGNS; POWER DISTRIBUTION SYSTEM; POWER DISTRIBUTIONS;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 4043166534     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2002.1057924     Document Type: Conference Paper

References (13)

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