Modeling and measurement of the Alpha 21364 package

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 2001, Pages 283-286

  Tsuk, Michael ^a   Dame, Roger ^a   Dvorscak, Daniel ^a   Houghton, Chris ^a   St Laurent, Jim ^a  

^a HEWLETT PACKARD COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BANDWIDTH; CAPACITANCE; CMOS INTEGRATED CIRCUITS; CROSSTALK; ELECTRIC POWER DISTRIBUTION; FLIP CHIP DEVICES; INDUCTANCE; INTEGRATED CIRCUIT LAYOUT; MICROPROCESSOR CHIPS; TRANSMISSION LINE THEORY;

ALPHA MICROPROCESSOR; ELECTROMAGNETIC ANALYSIS; LOOP INDUCTANCES; PARTIAL INDUCTANCES; QUASISTATIC INDUCTANCE;

ELECTRONICS PACKAGING;

EID: 0035699436     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. A 1.2 GHz alpha microprocessor with 44.8 GB/s chip pin bandwidth
2. Three-dimensional interconnect analysis using partial element equivalent circuits
3. FastCap: A multipole accelerated 3-D capacitance extraction program
4. FASTHENRY: A multipole-accelerated 3-D inductance extraction program
5. The use of loop inductances in signal integrity modeling