Recovery of open via after electromigration in Cu dual Damascene interconnect

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 2002, Pages 435-436

  Sun, Yinghua ^a   Zhou, Peng ^a   Kim, Dae Yong ^a   Goodson, Kenneth E ^a   Wong, S Simon ^a  

^a Stanford University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CURRENT DENSITY; MICROSCOPIC EXAMINATION; STRESS ANALYSIS;

INFRARED MICROSCOPES;

ELECTROMIGRATION;

EID: 0036087933     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)