The joint strength and microstructure of fluxless Au/Sn solders in InP-based laser diode packages

Journal of Electronic Materials

Volumn 34, Issue 10, 2005, Pages 1318-1323

  Sheen, M T ^a   Ho, Y H ^b   Wang, C L ^b   Hsieh, K C ^b   Cheng, W H ^b  

^a YUNG TA INSTITUTE OF TECHNOLOGY AND COMMERCE   (Taiwan)

^b NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

Author keywords

Finite element method (FEM); Laser diode package; Solder joint strength; Thermal aging

Indexed keywords

FINITE ELEMENT METHOD; GOLD ALLOYS; MICROSTRUCTURE; SEMICONDUCTING INDIUM PHOSPHIDE; SEMICONDUCTOR LASERS; TIN ALLOYS;

LASER-DIODE PACKAGE; SOLDER-JOINT STRENGTH; TEMPERATURE-CYCLING TESTING; THERMAL AGING;

SOLDERING ALLOYS;

EID: 27144463668     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0257-4     Document Type: Article

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