The effect of Cu reflow on the Pd-Cu-Ni ternary alloy membrane fabrication for infinite hydrogen separation

Thin Solid Films

Volumn 516, Issue 10, 2008, Pages 3036-3044

  Kim, Dong Won ^a   Park, Yong Joon ^a   Moon, Jin Wook ^a   Ryi, Shin Kun ^b   Park, Jong Soo ^c  

^a Kyonggi University   (South Korea)

^b Korea University   (South Korea)

^c Korea Institute of Energy Research (KIER)   (South Korea)

Author keywords

Cu reflow process; Functional gradient membrane; Infinity hydrogen separation; Pd alloy membrane; Pd Cu Ni ternary alloy membrane; Sputtering deposition

Indexed keywords

COPPER; DEPOSITION; HYDROGEN; SPUTTERING; THIN FILMS;

INFINITY HYDROGEN SEPARATION; REFLOW PROCESS; SPUTTERING DEPOSITION;

TERNARY ALLOYS;

EID: 39649122374     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2007.11.126     Document Type: Article

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