Optimizing wire bonding processes for maximum factory portability

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2002, Pages 329-334

  Gillotti, Gary ^a   Cathcart, Ray ^a  

^a Kulicke and Soffa   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; OPTIMIZATION; PROCESS ENGINEERING; SENSITIVITY ANALYSIS;

FREE AIR BALL FORMATION; MAXIMUM FACTORY PORTABILITY; WIRE BONDING;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0036395360     PISSN: 10898190     EISSN: None     Source Type: Journal    
DOI: 10.1109/IEMT.2002.1032774     Document Type: Article

References (0)