Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling

Microelectronics Reliability

Volumn 48, Issue 1, 2008, Pages 83-104

  Nakadaira, Yoshikuni ^a   Jeong, Seyoung ^a   Shim, Jongbo ^a   Seo, Jaiseok ^a   Min, Sunhee ^a   Cho, Taeje ^a   Kang, Sayoon ^a   Oh, Seyong ^a  

^a SAMSUNG Electronics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL WHISKERS; GRAIN BOUNDARIES; LEAD; MATHEMATICAL MODELS; THERMAL CYCLING; THIN FILMS;

EPOXY MOLD COMPOUND (EMC); GALVANIC CORROSION; HIGH HUMID ENVIRONMENTS; TIN WHISKERS;

TIN;

EID: 39149125510     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2007.01.091     Document Type: Article

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