A SAW filter integrated on a silicon passive substrate used for system in package

Sensors and Actuators, A: Physical

Volumn 142, Issue 1, 2008, Pages 185-191

  Georgel, V ^a,c   Verjus, F ^a   van Grunsven, E C E ^b   Poulichet, P ^c   Lissorgues, G ^c   Pellet, C ^d   Chamaly, S ^e   Bourouina, T ^c  

^a NXP SEMICONDUCTORS   (France)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

^c ESIEE PARIS   (France)

^d UNIVERSITÉ BORDEAUX 1   (France)

^e TEMEX   (France)

Author keywords

Integration; Packaging; Polymer; SAW filter

Indexed keywords

ACOUSTIC SURFACE WAVE DEVICES; ELECTRIC FILTERS; FINITE ELEMENT METHOD; MEMS;

BENZOCYCLOBUTENE (BCB); ELECTRICAL OPERATION; SAW FILTER;

ELECTRONICS PACKAGING;

EID: 38849203042     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2007.07.029     Document Type: Article

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