Microstructure and hardening mechanisms in a-Si3N4/nc-TiN nanostructured multilayers

Thin Solid Films

Volumn 516, Issue 8, 2008, Pages 1864-1870

  Yu, Lihua ^a   Dong, Shirun ^a   Xu, Junhua ^a   Kojima, Isao ^b  

^a JIANGSU UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

Hardness; Multilayers; Nanostructure; Silicon nitride Titanium nitride; Thermal stress

Indexed keywords

HARDENING; HARDNESS; MAGNETRON SPUTTERING; MICROSTRUCTURE; MULTILAYERS; NANOSTRUCTURED MATERIALS; THERMAL STRESS; TITANIUM NITRIDE; X RAY DIFFRACTION;

DEPOSITION TEMPERATURE; LAYER THICKNESS RATIO; RADIO-FREQUENCY REACTIVE MAGNETRON SPUTTERING;

SILICON NITRIDE;

EID: 38649095961     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2007.09.022     Document Type: Article

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