Aging phenomena in the removal of nano-particles from Si wafers

Solid State Phenomena

Volumn 134, Issue , 2008, Pages 155-158

  Vereecke, G ^a   Veltens, J ^b   Xu, K ^c   Eitoku, A ^d   Sano, K ^d   Arnauts, S ^a   Kenis, K ^a   Snow, J ^d   Vinckier, C ^e   Mertens, P W ^a  

^a IMEC   (Belgium)

^b Dept REGA   (Belgium)

^c SEZ AG   (Austria)

^d DAINIPPON SCREEN MFG CO LTD   (Japan)

^e UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

Aerosol spraying; Aging; Brush scrubbing; Megasonic cleaning; Particle removal

Indexed keywords

AGING OF MATERIALS; CLEANING; ETCHING; HUMIDITY CONTROL; NANOPARTICLES; PARTICLE SIZE; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICES; SILICA; SILICON NITRIDE;

AEROSOL SPRAYING; BRUSH SCRUBBING; MEGASONIC CLEANING; PARTICLE REMOVAL; PARTICLE REMOVAL EFFICIENCY; PHYSICAL COMPONENTS; POTENTIAL THREATS; SEMICONDUCTOR MANUFACTURING;

SILICON WAFERS;

EID: 38549174149     PISSN: 10120394     EISSN: 16629779     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/SSP.134.155     Document Type: Conference Paper

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