Particle metrology in CMP slurries - Potential and limitations of relevant measuring methods

Materials Research Society Symposium Proceedings

Volumn 991, Issue , 2007, Pages 107-118

  Stintz, Michael ^a   Barthel, Herbert ^b   Moinpour, Mansour ^c  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

^b WACKER CHEMIE AG   (Germany)

^c INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVES; CHEMICAL MECHANICAL POLISHING; NANOPARTICLES; PHOTON CORRELATION SPECTROSCOPY; TRANSMISSION ELECTRON MICROSCOPY;

INTERPARTICLE FORCES; ULTRASONIC SPECTROSCOPY; WAFER SURFACES;

SLURRIES;

EID: 38549116061     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-0991-c04-02     Document Type: Conference Paper

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