The impact of agglomerates on the chemical mechanical polishing (CMP) of wafer surfaces with colloidal slurries

VDI Berichte

Volumn , Issue 1803, 2003, Pages 103-108

  Kuntzsch, Timo ^a   Stintz, Michael ^a   Ripperger, Siegfried ^a   Witnik, Ulrike ^b  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

^b Infineon T Dresden GmbH/C OHG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COLLOIDAL SLURRIES; MECHANICAL STRESSES; WAFER POLISHING;

CHEMICAL MECHANICAL POLISHING; COLLOIDS; FILTRATION; INTEGRATED CIRCUITS; PARTICLE SIZE ANALYSIS; POLYSTYRENES; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICES; SHRINKAGE; SILICON WAFERS; SLURRIES; STRESSES;

AGGLOMERATION;

EID: 4644244248     PISSN: 00835560     EISSN: None     Source Type: Book Series    
DOI: None     Document Type: Article

References (6)

1. Steigerwald, J. M.; Murarka, S. P.; Gutmann, R. J.: Chemical Mechanical Planarization of Microelectronic Materials. John Wiley & Sons, New York 1997
2. Nagahara, R.; Lee, S. K.; You, H. M.: The Effect of Slurry Particle Size on Defect Levels for a BPSG CMP Process. Proceedings of VMIC Conference, Santa Clara / USA, June 1996
3. Basim, G. B.; Adler, J. J.; Mahajan, U.; Singh, R. K.; Moudgil, B. M.: Effect of Particle Size of Chemical Mechanical Polishing Slurries for Enhanced Polishing with minimal defects. J. Electrochem. Soc. 2000, 147 (9), 3523/3528
4. Kuntzsch, T.; Witnik, U.; Hollatz, M.; Stintz, M.; Ripperger, S.: Characterization of Slurries used for Chemical Mechanical Polishing (CMP) in the Semiconductor Industry. submitted to Chemical Engineering & Technology 03/2003
5. Corbett, M.: CMP slurries: A wild ride ahead. Solid State Technology 43 (2000) 12, 72/76
6. Lin, Z.; Vasilopoulos, G.; Adrian, K.; Blum, R.; Friedman, P.: CMP Filter Plugging Mechanisms and Filter Lifetime Optimization. Proceedings of CMP-MIC Conference, Santa Clara/USA, 11/12 Feb. 1999, 264/267