Acid diffusion characteristics of RELACS™ coating for 193nm lithography

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5376, Issue PART 1, 2004, Pages 285-293

  Hong, Sungeun ^a   Nishibe, Takeshi ^a   Okayasu, Tetsuo ^a   Takahashi, Kiyohisa ^a   Takano, Yusuke ^a   Kang, Wenbing ^a   Tanaka, Hatsuyuki ^a  

^a SÜD CHEMIE AG   (Germany)

Author keywords

Acid diffusion; Chemical exposure; Chemically amplified resist; RELACS coating; Thermal acid gnerators

Indexed keywords

AMPLIFICATION; CATALYSTS; CHEMICAL ANALYSIS; DIFFUSION; DISSOLUTION; HYDROGEN BONDS; LITHOGRAPHY; MOLECULAR STRUCTURE; PH EFFECTS;

ACID DIFFUSION; CHEMICAL EXPOSURE; NANO-SCALE LITHOGRAPHY; THERMAL ACID GENERATORS (TAG);

PHOTORESISTS;

EID: 3843142674     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.534612     Document Type: Conference Paper

References (7)

1. S. Hong, Y. Takano, T. Kanda, T. Kudo, M. Padmanaban, and H. Tanaka, Proc. SPIE, 5039, 195 (2003).
2. Z. Tadmor and C.G. Gogos, Principles of Polymer Processing, John Wiley & Sons, Inc., New York, (1979).
3. J. C. Jung, S. K. Lee, G. Lee, C. W. Koh, K. K. Kong, Y. S. Hwang, J. S. Kim, and K. S. Shin, J. of Photopol. Sci. and Technol., Vol. 14, 3, 419 (2001).
4. T. Kanda, H. Tanaka, and Y. Kinoshita, Proc. SPIE, 3999, 881(2000).
5. M.Toriumi, T. Ohfuji, M. Endo, and H. Morimoto, Proc. SPIE, 3678, 368 (1999).
6. M.Toriumi, I. Okabe, T. Ohfuji, M. Endo, and H. Morimoto, Proc. SPIE, 3999, 1056 (2000).
7. J. Crank and G. S. Park, Eds., Diffusion in Polymers, Academic Press, (1968).