Role of rapid photothermal processing in environmentally conscious semiconductor manufacturing

Journal of Materials Research

Volumn 13, Issue 1, 1998, Pages 61-67

  Sharangpani, R ^a,b   Singh, R ^a  

^a AMRL   (United States)

^b AG Associates Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; ENERGY EFFICIENCY; ENVIRONMENTAL PROTECTION; LAWS AND LEGISLATION; PHOTOCHEMICAL REACTIONS; QUANTUM THEORY; THERMAL EFFECTS;

ECOLOGICAL PRESERVATION EFFORTS; QUANTUM PHOTOEFFECTS; RAPID ISOTHERMAL PROCESSING; RAPID PHOTOTHERMAL PROCESSING;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 3843063326     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.1998.0009     Document Type: Article

References (23)

1. R&D Mag. Res. Bull. 9 (December 1994).
2. Walton, Energy User News 19 (10), 29 (1994).
3. D. T. Allen, Mater. Res. Soc. Bull. 30 (1992).
4. B. Newboe, Semicond. Int. 50 (November, 1993).
5. The National Technology Roadmap for Semiconductors (Semiconductor Industry Association, 1994), p. 66.
6. Reference 5, pp. 70-77.
7. R. Singh, J. Appl. Phys. 63, R59 (1988).
8. R. Singh, R. Sharangpani, K. C. Cherukuri, Y. Chen, D. M. Dawson, K. F. Poole, A. Rohatgi, S. Narayan, and R. P. S. Thakur, in Rapid Thermal and Integrated Processing V, edited by J. C. Gelpey, M. Ozturk, R. P. S. Thakur, A. Fioty, and F. Roozeboom (Mater. Res. Soc. Symp. Proc. 429, Pittsburgh, PA, 1996), p. 81.
9. Private communication with Mr. Leonard Rosenbaum (CVD Inc., Ronkonkoma, NY) and Eric Collins (Thermcraft, Winston Salem, NC).
10. Private communication with Mr. Jeff Kmirk, AG Associates, Anaheim, CA.
11. R. Singh, P. Chou, F. Radpour, A. J. Nelson, and H. S. Ullal, J. Appl. Phys. 66, 2381 (1989).
12. R. Singh, R. Sharangpani, and Y. Chen, Proc. 13th Int. Conf. on CVD, edited by T. M. Besmann, M. D. Allendorf, M. Robinson, and R. K. Ulrich (The Electrochemical Society, Pennington, NJ, 1996), Vol. 96-5, p. 213.
13. R. Singh, Proc. Int. Conf. on Beam Processing of Advanced Materials (The Minerals, Metals & Materials Society, Warrendale, PA, 1993), p. 619.
14. R. Sharangpani, K. C. Cherukuri, and R. Singh, J. Electrochem. Soc. 144, 669 (1997).
15. R. Singh, C. Gong, and J. Chaudhary, Novel Techniques in Synthesis and Processing of Advanced Materials, edited by J. Singh and S. M. Copley (The Minerals, Metals and Materials Society, Warrendale, PA, 1994), p. 215.
16. Ushio America Inc. Product Information, 20101 South Vermont Ave., Torrance, CA 90502, p. 8.
17. R. Sharangpani, R. Singh, M. Drews, and K. Ivey, J. Electron. Mater. 26, 402 (1997).
18. R. Singh, K. Cherukuri, L. Vedula, A. Rohatgi, and A. Narayanan, J. Electron. Mater. 26, 1421 (1997).
19. L. A. Sullivan and B. Han, Solid State Technol. 91 (May, 1996).
20. R. Sharangpani and R. Singh, in Proc. 3rd Dielectrics for ULSI/VLSI Multilevel Interconnect Conf. (DUMIC), edited by T. E. Wade (VLSI Multilevel Interconnect Conference, 1997).
21. Teflon AF Price List, published by DuPont Polymers, August 1989.
22. Peter Singer, Semicond. Int. 92 (June 1993).
23. R. Sharangpani and R. Singh, Rev. Sci. Instrum. 68, 1564 (1997).