Fabrication, integration and reliability of nanocomposite based embedded capacitors in microelectronics packaging

Journal of Materials Chemistry

Volumn 18, Issue 5, 2008, Pages 537-544

  Das, Rabindra N ^a   Lauffer, John M ^a   Markovich, Voya R ^a  

^a Endicott Interconnect Technologies Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BARIUM TITANATE; CAPACITORS; EPOXY RESINS; MICROELECTRONICS; PERMITTIVITY; THIN FILMS;

EMBEDDED CAPACITORS; MICROELECTRONICS PACKAGING;

NANOCOMPOSITES;

EID: 38349140656     PISSN: 09599428     EISSN: 13645501     Source Type: Journal    
DOI: 10.1039/b712051f     Document Type: Article

References (17)

1. Microelectronics Packaging Handbook, 2nd edn, ed. R. R. Tummala, E. J. Rymaszewski and A. J. Klopfenstein, Kluwer, Norwell, MA, 1999, pp. 15-36
2. Passive components technology roadmap, National Electronics Manufacturing Technology Roadmaps, International Electronic Manufacturing Initiative (www.inemi.org), Herndon, VA, December 1998
3. W. Jillek W. K. C. Yung Embedded components in printed circuit boards: a processing technology review Int. J. Adv. Manuf. Technol. 2005 25 3-4 350 360
4. Passive Integration: Easier Said Than Done, Prismark Partners LLC (www.prismark.com), Cold Spring Harbor, NY, August 1997
5. J. E. Post Microwave performance of MCM-D embedded capacitors with interconnects Microwave Opt. Technol. Lett. 2005 46 5 487 492
6. N. G. Devaraju E. S. Kim B. I. Lee Microelectron. Eng. 2005 82 1 71 83
7. Y. Rao S. Ogitani P. Kohl C. P. Wong Novel polymer-ceramic nanocomposite based on high dielectric constant epoxy formula for embedded capacitor application J. Appl. Polym. Sci. 2002 83 5 1084 1090
8. Y. Rao C. P. Wong Material characterization of a high-dielectric-constant polymer-ceramic composite for embedded capacitor for RF applications J. Appl. Polym. Sci. 2004 92 4 2228 2231
9. H. Windlass, P. M. Raj, D. Balaraman, S. K. Bhattacharya and R. R. Tummala, Colloidal processing of polymer-ceramic nanocomposites for integral capacitors, in IMAPS International Symposium on Advanced Packaging Materials, International Microelectronics Packaging Society, Washington, DC, 2001, pp. 393-398
10. S. Ramesh B. A. Shutzberg C. Haung J. Gao E. P. Giannelis Dielectric nanocomposites for integral thin film capacitors: Materials design, fabrication, and integration issues IEEE Trans. Adv. Packag. 2003 26 1 17 24
11. C. Dimitrakopoulos D. Mascaro IBM J. Res. Dev. 2001 45 1 11 27
12. H. Edzer A. Huitema G. Gelnick J. Bas P. V. D. Putten K. Kuijk K. Hart E. Cantatore D. de Leeuw Adv. Mater. 2002 14 17 1201 1204
13. L. Ma Y. Yang Appl. Phys. Lett. 2004 85 11 5084 86
14. R. N. Das P. Pramanik Low temperature chemical synthesis of Nano size ceramics Br. Ceram. Trans. 2000 99 4 153 158
15. S. D Cho, J.-Y. Lee and K. W. Paik, Effect of particle size on dielectric constant and leakage current of epoxy/barium titanate (BaTiO3) composite films for integral capacitors, in Intl. Conference on Electronic Materials and Packaging, IEEE, Los Alamitos, CA, 2001, pp. 63-68
16. L. A. Knauss J. M. Pond J. S. Horwitz D. B. Chrisey The effect of annealing on the structure and dielectric properties of BaxSr 1-xTiO3 ferroelectric thin films Appl. Phys. Lett. 1996 69 1 25 27
17. M. Kawasaki, Y. Hara, Y. Yamashiki, N. Asahi, R. Nagase, T. Ueoka, M. Yoshioka and T. Nonaka, Development of High-k Inorganic/Organic Composite Material for Embedded Capacitors, in 2004 Electronic Components and Technology Conference, IEEE, Los Alamitos, CA, 2004, pp. 525-530