Crystallographic cracking behavior in silicon single crystal wafer

Materials Science and Engineering: B

Volumn 103, Issue 1, 2003, Pages 49-56

  Tan, J ^a   Li, S X ^a   Wan, Y ^b   Li, F ^a   Lu, K ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

^b INSTITUTE OF METAL RESEARCH   (China)

Author keywords

Brittle ductile transition; Crack; Cross slip zone; Silicon; Three point bending

Indexed keywords

BENDING (DEFORMATION); BRITTLENESS; CRACK INITIATION; CRYSTALLOGRAPHY; DUCTILITY; SINGLE CRYSTALS;

CRACKING BEHAVIOR;

SILICON WAFERS;

EID: 0042623430     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5107(03)00147-8     Document Type: Article

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