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Volumn 16, Issue 3, 2004, Pages 31-33

Dissolution of solids in contact with liquid solder

Author keywords

Physical properties of materials; Soldering

Indexed keywords

CRYSTAL GROWTH; DISSOLUTION; INTERFACES (MATERIALS); SOLUBILITY; SOLUTIONS; THERMODYNAMIC STABILITY;

EID: 9144237003     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910410562509     Document Type: Article
Times cited : (20)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.