Thermal analysis of solid-state devices and circuits: An analytical approach

Solid-State Electronics

Volumn 44, Issue 10, 2000, Pages 1789-1798

  Rinaldi, N ^a  

^a UNIVERSITY OF NAPLES FEDERICO II   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; COMPUTATIONAL COMPLEXITY; COMPUTER SIMULATION; ELECTROSTATICS; HEAT RESISTANCE; IMAGE ANALYSIS; INTEGRATION; OPTIMIZATION; SEMICONDUCTOR DEVICE MODELS; TEMPERATURE DISTRIBUTION; THERMOANALYSIS;

ELECTRO-THERMAL SIMULATIONS;

SEMICONDUCTOR DEVICE STRUCTURES;

EID: 0034291496     PISSN: 00381101     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0038-1101(00)00120-9     Document Type: Article

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