Adhesive penetration of wood cell walls investigated by scanning thermal microscopy (SThM)

Holzforschung

Volumn 62, Issue 1, 2008, Pages 91-98

  Konnerth, Johannes ^a   Harper, David ^b   Lee, Seung Hwan ^c   Rials, Timothy G ^b   Gindl, Wolfgang ^a,d  

^a UNIVERSITY OF NATURAL RESOURCES AND LIFE SCIENCES   (Austria)

^b UNIVERSITY OF TENNESSEE   (United States)

^c NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

^d KOMPETENZZENTRUM HOLZ GMBH   (Austria)

Author keywords

Adhesive penetration; Scanning thermal microscopy (SThM); Wood

Indexed keywords

EPOXY RESINS; FORMALDEHYDE; POLYURETHANES; THERMAL CONDUCTIVITY; WOOD;

SCANNING THERMAL MICROSCOPY (STHM); THERMAL PROBE; THERMAL RESOLUTION;

CELLS;

CELLS; FORMALDEHYDE; POLYEPOXIDES; POLYURETHANES; THERMAL CONDUCTIVITY; WOOD;

EID: 36849064266     PISSN: 00183830     EISSN: 1437434X     Source Type: Journal    
DOI: 10.1515/HF.2008.014     Document Type: Article

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