The interphase in phenol-formaldehyde and polymeric methylene di-phenyl-di-isocyanate glue lines in wood

International Journal of Adhesion and Adhesives

Volumn 24, Issue 4, 2004, Pages 279-286

  Gindl, Wolfgang ^a,c   Schöberl, Thomas ^b   Jeronimidis, George ^c  

^a UNIVERSITY OF NATURAL RESOURCES AND LIFE SCIENCES   (Austria)

^b UNIVERSITY OF LEOBEN   (Austria)

^c UNIVERSITY OF READING   (United Kingdom)

Author keywords

A. Adhesives for wood; B. Wood; D. Adhesion by mechanical interlocking; D. Mechanical properties of adhesives

Indexed keywords

CHEMICAL BONDS; DEFORMATION; FLUORESCENCE; FORMALDEHYDE; HARDNESS; MICROSCOPIC EXAMINATION; PHENOLS; TENSILE STRESS; TRANSMISSION ELECTRON MICROSCOPY; ULTRAVIOLET RADIATION; WOOD;

ADHESION BY MECHANICAL INTERLOCKING; ADHESIVE FOR WOOD; MECHANICAL PROPERTIES OF ADHESIVES;

GLUES;

EID: 1642388384     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijadhadh.2003.10.002     Document Type: Article

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