A combined imaging, microthermal and spectroscopic study of a multilayer packaging system

Packaging Technology and Science

Volumn 17, Issue 3, 2004, Pages 129-138

  Woodward, I ^a   Ebbens, S ^a   Zhang, J ^a   Luk, S ^a   Patel, N ^a   Roberts, C J ^b  

^a Molecular Profiles Ltd   (United Kingdom)

^b UNIVERSITY OF NOTTINGHAM   (United Kingdom)

Author keywords

AFM; Multiplayer; Packaging materials; Scanning thermal microscopy

Indexed keywords

ATOMIC FORCE MICROSCOPY; CHEMICAL RESISTANCE; DRUG PRODUCTS PLANTS; FOURIER TRANSFORM INFRARED SPECTROSCOPY; HEATING; MELTING; PACKAGING MATERIALS; THERMOANALYSIS;

ATOMIC FORCE MICROSCOPY (AFM); MULTIPLAYERS; PACKAGING SYSTEMS; SCANNING THERMAL MICROSCOPY (STHM);

PACKAGING;

CHEMICAL RESISTANCE; HEATING; MELTING; PACKAGING; PACKAGING MATERIALS; THERMAL ANALYSIS;

EID: 3042634482     PISSN: 08943214     EISSN: None     Source Type: Journal    
DOI: 10.1002/pts.649     Document Type: Article

References (25)

1. World Health Organization Technical Report Series, No. 902, 2002.
2. Henry BM, Dinelli F, Zhao K-Y et al. Thin Solid Films 1999; 356: 500-505.
3. Moosheimer U and Bichler Ch. Surface Coatings Technol 1999; 119: 812-819.
4. Mueller C, Capaccio G, Hiltner A and Baer E. J. Appl. Polym. Sci. 1998; 70: 2021-2030.
5. Oswin CR. Plastic films and Packaging. Applied Science Publishers: London, 1975.
6. He Y. Thermochim. Acta 2002; 392: 13-21.
7. Binnig G and Quate CF. Phys. Rev. Lett. 1986; 57: 930-933.
8. Bar G, Thomann Y, Brandsch R, Cantow HJ and Whangbo M-H. Langmuir 1997; 13: 3807-3812.
9. Hammiche A, Pollock HM, Song M and Hourston DJ. Meas. Sci. Technol. 1996; 7: 142-150.
10. Price DM, Reading M, Hammiche A and Pollock HM. Int. J. Pharmaceut. 1999; 192: 85-96.
11. Pollock HM and Hammiche A. J. Phys. D-Appl. Phys. 2001; 34: R23-R53.
12. Zhang J, Roberts CJ, Shakesheff KM, Davies MC and Tendler SJB. Macromolecules 2003; 36: 1215-1221.
13. Chen X, Roberts CJ, Zhang J, Davies MC and Tendler SJB. Surface Sci. 2002; 519: L593-L598.
14. Feng Y and Hay JN. Polymer 1998; 39: 6723-6731.
15. Ferreira ML, Galland GB, Damiani and Villar MA. J. Polym. Sci. A 2001; 39: 205-2018.
16. Danesh A, Chen X, Davies MC et al. Langmuir 2000; 16: 866-870.
17. Chen X, Davies MC, Roberts CJ et al. Ultramicroscopy 1998; 75: 171-181.
18. Finot MO and McDermott MT. J. Am. Chem. Soc. 1997; 119: 8564-8565.
19. Garcia-Ayuso G, Vazquez L and Martinez-Duart JM. Surface Coatings Technol. 1996; 80: 203-206.
20. Barker CP, Kochem K-H, Revell KM, Kelly RSA and Badyal JPS. Thin Solid Films 1995; 257: 77-82.
21. Balk LJ, Maywald M and Pylkki R. 9th Conference on Microscopy of Semiconducting Materials (Oxford). Inst. Conf. Ser. 1995; 146: 655-658.
22. Price DM, Reading M, Hammiche A, Pollock HM and Branch MG. Thermochim. Acta 1999; 332:143-149.
23. Kader MA, Bhowmick AK, Inoue T and Chiba T. J. Materials Sci. 2002; 37: 1503-1513.
24. Shi L, Plyasunov S, Bachtold A, McEuen PL and Majumdar A. Appl. Phys. Lett. 2000; 77: 4295-4297.
25. Vanden Eynde A, Mathot V, Koch MHJ and Raynaers H. Polymer 2000; 41: 3437-3453.