Effects of chip-package interaction on mechanical reliability of Cu interconnects

AIP Conference Proceedings

Volumn 945, Issue , 2007, Pages 170-179

  Uchibori, Chihiro J ^a   Xhang, Xuefeng ^b   Im, Sehyuk ^b   Ho, Paul S ^b   Nakamura, Tomoji ^c  

^a FUJITSU LABORATORIES OF AMERICA   (United States)

^b The University of Texas at Austin   (United States)

^c FUJITSU LABORATORIES LTD   (Japan)

Author keywords

Chip package interaction; Energy release rate; Reliability

Indexed keywords

EID: 36849042738     PISSN: 0094243X     EISSN: 15517616     Source Type: Conference Proceeding    
DOI: 10.1063/1.2815777     Document Type: Conference Paper

References (9)

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