Hybrid integration of end-to-end optical interconnects on printed circuit boards

IEEE Transactions on Components and Packaging Technologies

Volumn 30, Issue 4, 2007, Pages 708-715

  Huang, Zhaoran Rena ^a   Guidotti, Daniel ^b   Wan, Lixi ^b   Chang, Yin Jung ^b   Yu, Jianjun ^b   Liu, Jin ^b   Kuo, Hung Fei ^b   Chang, Gee Kung ^b   Liu, Fuhan ^b   Tummala, Rao R ^b  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Chip to chip; Embedded devices; Embedded systems; Optical communication; Optical integration; Optical interconnect; Polymer waveguide; Polymers; Printed circuit boards; Printed circuit boards (PCBs); System on package (SOP); Waveguides

Indexed keywords

EMBEDDED SYSTEMS; LASER OPTICS; OPTICAL COMMUNICATION; OPTICAL INTERCONNECTS; OPTICAL WAVEGUIDES; PHOTODETECTORS;

EMBEDDED DEVICES; END-TO-END OPTICAL INTERCONNECTS; OPTICAL INTEGRATION; SYSTEM-ON-PACKAGE (SOP);

PRINTED CIRCUIT BOARDS;

EID: 36849012492     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2007.901757     Document Type: Article

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