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Applied Physics A: Materials Science and Processing

Volumn 90, Issue 2, 2008, Pages 263-266

Kinetics characterization of the oxidation of Cu thin films at low temperature by using sheet resistance measurement

(6) Zhong, C a Jiang, Y M a Luo, Y F a Deng, B a Zhang, L a Li, J a

a FUDAN UNIVERSITY (China)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; COPPER; GRAIN BOUNDARIES; KINETICS; LOW TEMPERATURE EFFECTS; OXIDATION; SHEET RESISTANCE;

DIFFUSION MECHANISM; FILM SHEET RESISTANCE; GRAIN BOUNDARY DIFFUSION;

THIN FILMS;

EID: 36749101905 PISSN: 09478396 EISSN: 14320630 Source Type: Journal
DOI: 10.1007/s00339-007-4259-3 Document Type: Article

Times cited : (23)

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