Fracture of anodic-bonded silicon-thin film glass-silicon triple stacks

Engineering Fracture Mechanics

Volumn 75, Issue 5, 2008, Pages 1064-1082

  Shang, L Y ^a   Zhang, Z L ^a   Skallerud, B ^a  

^a NORWEGIAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Norway)

Author keywords

Interface fracture; MEMS reliability; Notch mechanics; Path independent integral; Wafer bonds

Indexed keywords

EIGENVALUES AND EIGENFUNCTIONS; FAILURE (MECHANICAL); FINITE ELEMENT METHOD; FRACTURE; GEOMETRY; INTEGRAL EQUATIONS; STRESS INTENSITY FACTORS;

INTERFACE FRACTURE; NOTCH MECHANICS; PATH-INDEPENDENT INTEGRAL; SILICON-THIN FILM GLASS-SILICON; WAFER BONDS;

THIN FILMS;

EIGENVALUES AND EIGENFUNCTIONS; FAILURE (MECHANICAL); FINITE ELEMENT METHOD; FRACTURE; GEOMETRY; INTEGRAL EQUATIONS; STRESS INTENSITY FACTORS; THIN FILMS;

EID: 36749023269     PISSN: 00137944     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.engfracmech.2007.04.030     Document Type: Article

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