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Volumn 20, Issue 11, 2007, Pages

A high-speed superconducting digital autocorrelator operating at 20.48 GHz

Author keywords

[No Author keywords available]

Indexed keywords

BIT ERROR RATE; CURRENT DENSITY; DATA REDUCTION; SPECTRUM ANALYSIS; SUPERCONDUCTING DEVICES;

EID: 36448988612     PISSN: 09532048     EISSN: 13616668     Source Type: Journal    
DOI: 10.1088/0953-2048/20/11/S02     Document Type: Conference Paper
Times cited : (6)

References (12)
  • 4
    • 0035249896 scopus 로고    scopus 로고
    • Superconductor digital RF development for software radio
    • Brock D K, Mukhanov O A and Rosa J 2001 Superconductor digital RF development for software radio IEEE Commun. Mag. 39 174-9
    • (2001) IEEE Commun. Mag. , vol.39 , Issue.2 , pp. 174-179
    • Brock, D.K.1    Mukhanov, O.A.2    Rosa, J.3
  • 5
    • 0032023588 scopus 로고    scopus 로고
    • All-digital 1-bit RSFQ autocorrelator for radioastronomy applications: Design and experimental results
    • Rylyakov A V and Polonsky S V 1998 All-digital 1-bit RSFQ autocorrelator for radioastronomy applications: design and experimental results IEEE Trans. Appl. Supercond. 8 14-9
    • (1998) IEEE Trans. Appl. Supercond. , vol.8 , Issue.1 , pp. 14-19
    • Rylyakov, A.V.1    Polonsky, S.V.2
  • 6
    • 84910465946 scopus 로고    scopus 로고
    • Rylyakov A V 1997 Ultra-low-power RSFQ devices and digital autocorrelation of broadband signals PhD Dissertation Department of Physics, State University of New York at Stony Brook
    • (1997) PhD Dissertation
    • Rylyakov, A.V.1
  • 7
    • 0034207484 scopus 로고    scopus 로고
    • Chip-to-chip communication using a single flux quantum pulse
    • Maezawa M, Yamamori H and Shoji A 2000 Chip-to-chip communication using a single flux quantum pulse IEEE Trans. Appl. Supercond. 10 1603-5
    • (2000) IEEE Trans. Appl. Supercond. , vol.10 , Issue.2 , pp. 1603-1605
    • Maezawa, M.1    Yamamori, H.2    Shoji, A.3
  • 8
    • 0035268160 scopus 로고    scopus 로고
    • High-speed interchip data transmission technology for superconducting multi-chip modules
    • Gupta D, Li W, Kaplan S B and Vernik I V 2001 High-speed interchip data transmission technology for superconducting multi-chip modules IEEE Trans. Appl. Supercond. 11 731-4
    • (2001) IEEE Trans. Appl. Supercond. , vol.11 , Issue.1 , pp. 731-734
    • Gupta, D.1    Li, W.2    Kaplan, S.B.3    Vernik, I.V.4
  • 9
    • 68649123400 scopus 로고    scopus 로고
    • High speed data link between digital superconductor chips
    • Herr Q P, Smith A D and Wire M S 2002 High speed data link between digital superconductor chips Appl. Phys. Lett. 80 3210-2
    • (2002) Appl. Phys. Lett. , vol.80 , Issue.17 , pp. 3210-3212
    • Herr, Q.P.1    Smith, A.D.2    Wire, M.S.3
  • 10
    • 34547459601 scopus 로고    scopus 로고
    • High-speed experimental results for an adhesive-bonded superconducting multi-chip module
    • Kaplan S B, Dotsenko V and Tolpygo D 2007 High-speed experimental results for an adhesive-bonded superconducting multi-chip module IEEE Trans. Appl. Supercond. 17 971-4
    • (2007) IEEE Trans. Appl. Supercond. , vol.17 , Issue.2 , pp. 971-974
    • Kaplan, S.B.1    Dotsenko, V.2    Tolpygo, D.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.