Electrical resistivity of ultrafine-grained copper with nanoscale growth twins

Journal of Applied Physics

Volumn 102, Issue 8, 2007, Pages

  Chen, X H ^a   Lu, L ^a   Lu, K ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRODEPOSITION; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; PLASTIC DEFORMATION; TRANSMISSION ELECTRON MICROSCOPY;

NANOSCALE GROWTH TWINS; ROLLING STRAINS; ROOM TEMPERATURE (RT); ULTRAFINE GRAINED COPPER;

ELECTRIC CONDUCTIVITY;

EID: 35648956149     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2799087     Document Type: Article

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