Injection moulding integration of a red VCSEL illuminator module for a hologram reader sensor

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6585, Issue , 2007, Pages

  Keränen, Kimmo ^a   Saastamoinen, Toni ^b   Mäkinen, Jukka Tapani ^a   Silvennoinen, Mikko ^c   Mustonen, Ilpo ^b   Vahimaa, Pasi ^b   Jääskeläinen, Timo ^b   Lento, Ari ^d   Ojapalo, Anneli ^e   Schorpp, Marcus ^f   Hoskio, Pekka ^c   Karioja, Pentti ^a  

^a VTT TECHNICAL RESEARCH CENTRE OF FINLAND   (Finland)

^b UNIVERSITY OF EASTERN FINLAND   (Finland)

^c Perlos ^*  (Finland)

^d AALTO UNIVERSITY   (Finland)

^e Perlos   (Finland)

^f NOKIA RESEARCH CENTER   (United States)

Author keywords

Cost effective product; In mould sealing; Module integration; Red VCSEL chip

Indexed keywords

COST-EFFECTIVE PRODUCTS; IN-MOULD SEALING; MODULE INTEGRATION; RED VCSEL CHIPS;

INJECTION MOLDING; MICROPROCESSOR CHIPS; POLYCARBONATES;

SURFACE EMITTING LASERS;

EID: 36049000199     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.722700     Document Type: Conference Paper

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