Inmould integration of a microscope add-on system to a 1.3 Mpix camera phone

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6585, Issue , 2007, Pages

  Mäkinen, Jukka Tapani ^a   Keränen, Kimmo ^a   Hakkarainen, Jehki ^b   Silvennoinen, Mikko ^c   Salmi, Timo ^a   Syrjälä, Seppo ^b   Ojapalo, Anneli ^c   Schorpp, Marcus ^d   Hoskio, Pekka ^e   Karioja, Pentti ^a  

^a VTT TECHNICAL RESEARCH CENTRE OF FINLAND   (Finland)

^b TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

^c Perlos   (Finland)

^d NOKIA RESEARCH CENTER   (United States)

^e Electroplast Oy ^*

Author keywords

Heterogeneous optoelectronic integration; Injection moulding; Inmould sealing; Plastic optics

Indexed keywords

HETEROGENEOUS OPTOELECTRONIC INTEGRATION; INMOULD SEALING; PLASTIC OPTICS;

CAMERAS; EMBEDDED SYSTEMS; IMAGE ANALYSIS; INJECTION MOLDING; OPTOELECTRONIC DEVICES;

MOBILE PHONES;

EID: 36049052304     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.722741     Document Type: Conference Paper

References (3)

1. Heterogeneous optoelectronic integration, E. Towe, SPIE, Bellingham, Washington, 2000.
2. Injection moulding integration of a red VCSEL illuminator module for a hologram reader sensor, K Keränen T Saastamoinen, J-T. Mäkinen, M. Silvennoinen, I. Mustonen, P. Vahimaa, T. Jääskeläinen, A. Ojapalo M Schorpp P. Hoskio, P. Karioja, Proceedings of SPIE, v 6585, 2007
3. Add-on laser reading device for a camera phone, J-T. Mäkinen , K. Niemelä, H. Vasama, R Mattila M Aikio S Aikio, J. Aikio, Proceedings of SPIE, v 5962, 2005