Micropatterns of W-Cu composites fabricated by metal powder injection molding

Metals and Materials International

Volumn 13, Issue 5, 2007, Pages 391-394

  Kim, Soon Wook ^a   Kim, Young Do ^b   Suk, Myung Jin ^c  

^a MagnaChip Semiconductor Ltd   (South Korea)

^b Hanyang University   (South Korea)

^c Kangwon National University   (South Korea)

Author keywords

Ball milled W Cu powder; LIGA process; Micro MIM

Indexed keywords

BINARY ALLOYS; COPPER ALLOYS; FABRICATION; METAL MOLDING; MIM DEVICES; MOLD RELEASE AGENTS; PLASTIC MOLDS; PLASTICS MOLDING; POWDER METALLURGY; POWDER METALS; SINTERING;

CU POWDERS; INTRINSIC DEFECTS; LIGA PROCESS; METAL POWDER INJECTION MOLDING; MICRO MIM; MOLDING PRESSURE; MOLDING TEMPERATURE; PLASTIC MOLDING;

INJECTION MOLDING;

EID: 35948951971     PISSN: 15989623     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF03027873     Document Type: Article

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