Micro Metal Powder Injection Molding of W-Cu Nanocomposite Powder

Metals and Materials International

Volumn 11, Issue 3, 2005, Pages 205-208

  Kim, Soon Wook ^a   Suk, Myung Jin ^b   Kim, Young Do ^a   Moon, In Hyung ^a  

^a Hanyang University   (South Korea)

^b Samcheok National University   (South Korea)

Author keywords

LIGA technology; Micro MIM; Micromold; Nanocomposite; W Cu

Indexed keywords

BINARY ALLOYS; COPPER ALLOYS; METAL MOLDING; MICROELECTRONICS; NANOCOMPOSITES; PACKAGING MATERIALS; POWDER METALLURGY; POWDER METALS; TUNGSTEN ALLOYS;

LIGA TECHNOLOGY; MANUFACTURING TECHNOLOGIES; METAL POWDER INJECTION MOLDING; MICRO METAL INJECTION MOLDINGS; MICRO MIM; MICRO MOLDS; MICRO-ELECTRONIC DEVICES; MICRO-INJECTION MOLDING;

INJECTION MOLDING;

EID: 29144489135     PISSN: 15989623     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF03027443     Document Type: Article

References (9)

1. V. Piotter, T. Benzler, T. Gietzelt, R. Ruprecht, and J. Hausselt, Adv. Eng. Mater. 2, 639 (2002).
2. R. Ruprecht, T. Gietzelt, K. Müller, V. Piotter, and J. Haußelt, Microsyst. Technol. 8, 351 (2002).
3. R. Ruprecht, T. Benzler, and T. Hanemann, Microsyst. Technol. 4, 28 (1998).
4. J. C. Kim and I. H. Moon, Nanostrnct. Mater. 10, 283 (1998).
5. M. J. Suk, J. H. Hyun, J. S. Kim, Y. S. Kwon, and Y. D. Kim, Met. Mater. -Int. 8, 353 (2002)
6. J. C. Kim, S. S. Ryu, H. Lee, and I. H. Moon, Int. J. Powder Metall. 35, 47 (1999).
7. S. W. Kim, S. I. Lee, Y. D. Kim, and I. H. Moon, Mater. Lett. (In press).
8. A. Rota, T. V. Duong, and T. Hartwig, Microsyst. Technol. 8, 323 (2002).
9. S. S. Ryu, Y. D. Kim, and I. H. Moon, J. Alloy. Compd. 355, 233 (2002).