Prognostics implementation of electronics under vibration loading

Microelectronics Reliability

Volumn 47, Issue 12, 2007, Pages 1849-1856

  Gu, Jie ^a   Barker, Donald ^a   Pecht, Michael ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FATIGUE DAMAGE; FINITE ELEMENT METHOD; LIFE CYCLE; PRINTED CIRCUIT BOARDS; REAL TIME SYSTEMS; STRAIN GAGES; VIBRATION ANALYSIS;

BENDING CURVATURES; INTERCONNECT STRAIN VALUES; REMAINING LIFE PROGNOSTICS; VIBRATION LOADINGS;

ELECTRIC LOADS;

EID: 35548991366     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2007.02.015     Document Type: Article

References (10)

1. Vichare N., and Pecht M. Prognostics and health management of electronics. IEEE Trans Compon Pack Technol 29 1 (2006) 222-229
2. Ramakrishnan A., and Pecht M. A life consumption monitoring methodology for electronic systems. IEEE Trans Compon Pack Technol 26 3 (2003) 625-634
3. Mishra S, Pecht M, Smith T, McNee I, Harris R. Remaining life prediction of electronic products using life consumption monitoring approach. In: Proceedings of the European microelectronic package interconnection symposium, Cracow, Poland, June 16-18; 2002. p. 136-42.
4. Mathew S., Das D., Osterman M., Pecht M., and Ferebee R. Prognostic assessment of aluminum support structure on a printed circuit board. ASME J Electron Packag 128 4 (2006) 339-345
5. Vichare N, Pecht M. Enabling electronic prognostics using thermal data, In: Proceedings of the 12th international workshop on thermal investigation of ICs and systems, Nice, France; September 2006.
6. Steinberg D. Vibration analysis for electronic equipment. 3rd ed. (2000), John Wiley & Sons, Inc.
7. Chen Y. Predicting the vibration fatigue lives of electronic components mounted on a PWB, Ph.D. dissertation, Dept. of Mechanical Engineering, University of Maryland, College Park; 1993.
8. Kotlowitz R., and Taylor L. Compliance metrics for the inclined gull-wing, spider J-bend, and spider gull-wing lead designs for surface mount components. IEEE Trans Compon Hybr Manuf Technol 14 4 (1991) 771-779
9. IPC-SM-785, Guidelines for accelerated reliability testing of surface mount solder attachments; 1992.
10. Vichare N., Rodgers P., and Pecht M. Methods for binning and density estimation of load parameters for prognostics and health management. Int J Perform Eng 2 2 (2006)