Prognostics assessment of aluminum support structure on a printed circuit board

Journal of Electronic Packaging

Volumn 128, Issue 4, 2006, Pages 339-345

  Mathew, Sony ^a   Das, Diganta ^a   Osterman, Michael ^a   Pecht, Michael ^a   Ferebee, Robin ^b  

^a UNIVERSITY OF MARYLAND   (United States)

^b NASA MARSHALL SPACE FLIGHT CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FAILURE ANALYSIS; HEAT TRANSFER; PRINTED CIRCUIT BOARDS; SHOCK TESTING; TRANSISTORS;

ALUMINUM BRACKETS; BRACKET FAILURE; ELECTRONIC CIRCUIT BOARDS;

ALUMINUM;

EID: 33846663020     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2351897     Document Type: Article

References (8)

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