High-temperature spin-on adhesives for temporary wafer bonding

Journal of Microelectronics and Electronic Packaging

Volumn 4, Issue 3, 2007, Pages 105-111

  Pillalamarri, S ^a   Puligadda, R ^a   Brubaker, C ^b   Wimplinger, M ^b   Pargfrieder, S ^b  

^a BREWER SCIENCE INC   (United States)

^b EV GROUP   (Austria)

Author keywords

Spin on adhesives; Temporary adhesives; Temporary wafer bonding; Wafer thinning

Indexed keywords

DEPOSITION; ELECTRONICS PACKAGING; WAFER BONDING;

SPIN-ON ADHESIVES; TEMPORARY ADHESIVES; TEMPORARY WAFER BONDING; WAFER THINNING;

ADHESIVES;

EID: 35348959399     PISSN: 15514897     EISSN: None     Source Type: Journal    
DOI: 10.4071/1551-4897-4.3.105     Document Type: Article

References (5)

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