Chip embedding in printed circuit board production

IMAPS Nordic Annual Conference 2005

Volumn , Issue , 2005, Pages 165-171

  Ostmann, Andreas ^a   Kriechbaum, Arno ^b   De Baets, Johan ^c   Kostner, Hannes ^b  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^b AT and S ^*  (Austria)

^c IMEC   (Belgium)

Author keywords

Chip embedding; Die bonding; Lamination; Laser drilling

Indexed keywords

ACTIVE COMPONENTS; AL CONTACT; BASIC CONCEPTS; BOND LINE; BUILD-UP LAYERS; CHIP EMBEDDING; CIRCUIT BOARDS; CU BUMPS; DIE ATTACH FILM; DIE BONDING; DIE PLACEMENT; EUROPEAN RESEARCH PROJECT; FIDUCIALS; HIGH-ACCURACY POSITIONING; LAMINATION; LARGE-SCALE MANUFACTURING; LASER DIRECT IMAGING; LASER DRILLING; METALLIZATION PROCESS; MICROVIAS; PROCESS PARAMETERS; PROCESS STEPS; RESIN COATED COPPER; SEMICONDUCTOR CHIPS; ULTRA-THIN;

DIES; LAMINATING; RESEARCH;

PRINTED CIRCUIT BOARDS;

EID: 84866420404     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. A. Ostmann, A. Neumann, S. Weser, E. Jung, L. Böttcher and H. Reichl, "Realization of a Stackable Package Using Chip in Polymer Technology", Polytronic Conference, June 23.-26. 2002, Zalaegerszeg, Hungary.
2. W. Bauer, S. Purger, W. Schrittwieser, "Embedded Passive Technology from a Board Shops Perspective", CircuiTree Magazine October 2003.
3. A. Naumov, A. Kitai, S. Purger, W. Bauer, "Laser Trimming of Embedded Resistors for PWB Manufacturing", IMAPS Advanced Technology Workshop on Passive Integration, Ogunquit, Main, June 2002.
4. Hannes Stahr, Gnther Leising. "Interconnect solutions and material trends in future printed circuit boards", IMAPS Nordic Conference, Copenhagen, Sept. 2004.
5. HIDING DIES website www.hidingdies.net
6. rd European Microelectronics and Packaging Symposium, Prague, June 2004, pp. 111-116.