Two-dimensional optical interconnection based on two-layered optical printed circuit board

IEEE Photonics Technology Letters

Volumn 19, Issue 6, 2007, Pages 411-413

  Hwang, Sung Hwan ^a,b   Cho, Mu Hee ^a   Kang, Sae Kyoung ^a   Lee, Tae Woo ^a   Park, Hyo Hoon ^a   Rho, Byung Sup ^b  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Korea Photonics Technology Institute (KOPTI)   (South Korea)

Author keywords

90 bent fiber block; Chip to chip optical interconnection; Optical modules; Optical printed circuit board (OPCB); Passive assembly

Indexed keywords

2 LAYER; BENT FIBER; CHIP-TO-CHIP OPTICAL INTERCONNECTION; DATA TRANSMISSION; MAIN COMPONENT; OPTICAL INTERCONNECTIONS; OPTICAL MODULES; OPTICAL PLATFORMS; OPTICAL PRINTED CIRCUIT BOARDS; PARALLEL LINKS; PASSIVE ASSEMBLY;

FIBERS; OPTICAL INTERCONNECTS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; TWO DIMENSIONAL;

LIGHT TRANSMISSION;

EID: 35348891765     PISSN: 10411135     EISSN: None     Source Type: Journal    
DOI: 10.1109/LPT.2007.892888     Document Type: Article

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