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Volumn 2006, Issue , 2006, Pages 1693-1699
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MCM LGA package with optical I/O passively aligned to dual layer polymer waveguides in PCB
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Author keywords
[No Author keywords available]
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Indexed keywords
LAND GRID ARRAY (LGA);
SINGLE CHIP MODULES (SCM);
SYMMETRICAL MULTIPLE PROCESSOR (SMP);
THERMAL CONDUCTION MODULES (TCM);
BANDWIDTH;
BIT ERROR RATE;
CMOS INTEGRATED CIRCUITS;
FLIP CHIP DEVICES;
MICROPROCESSOR CHIPS;
MULTICHIP MODULES;
POLYMERS;
PRINTED CIRCUIT BOARDS;
SERVERS;
CHIP SCALE PACKAGES;
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EID: 33845573805
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ECTC.2006.1645886 Document Type: Conference Paper |
Times cited : (15)
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References (13)
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