A large area and 2 dimensional optical interconnection platform

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1916-1920

  Hwang, Sung Hwan ^a   Cho, Mu Hee ^a   Kang, Sae Kyoung ^a   Lee, Tae Woo ^a   Park, Hyo Hoon ^a   Rho, Byung Sup ^b  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Korea Photonics Technology Institute (KOPTI)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; INSERTION LOSSES; OPACITY; OPTICAL LINKS; PRINTED CIRCUIT BOARDS; TRANSMITTERS;

CHIP-TO-CHIP; FIBER BLOCKS; OPTICAL PLATFORM;

OPTICAL INTERCONNECTS;

EID: 35348887687     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.374061     Document Type: Conference Paper

References (14)

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