A stackable silicon interposer with integrated through-wafer inductors

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1235-1238

  Carlson, J ^a   Lueck, M ^a   Bower, C A ^a   Temple, D ^a   Feng, Z P ^b   Steer, M B ^b   Moll, A J ^c   Knowlton, W B ^c  

^a RTI INTERNATIONAL   (United States)

^b NORTH CAROLINA STATE UNIVERSITY   (United States)

^c BOISE STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEVICE STACKING; ELECTRONIC SYSTEMS; MINIATURIZATION; STACKABLE INTERPOSER; WAFER INDUCTORS;

ELECTRIC INDUCTORS; ELECTRONIC EQUIPMENT; SOLENOIDS; STACKING FAULTS; THREE DIMENSIONAL;

SILICON WAFERS;

EID: 35348880864     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373952     Document Type: Conference Paper

References (7)

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