Characteristics of a driver amplifier integrated 40 Gb/s EML module

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1994-1999

  Yun, Ho Gyeong ^a   Choi, Kwang Seong ^a   Kwon, Yong Hwan ^a   Choe, Joong Seon ^a   Moon, Jong Tae ^a  

^a Electronics and Telecommunications Research Institute (ETRI)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BANDWIDTH; ELECTRIC CURRENT MEASUREMENT; ELECTROOPTICAL EFFECTS; GAIN MEASUREMENT; INTEGRATED CIRCUITS;

RETURN LOSSES; SELECTIVE AREA GROWTH (SAG) METHODS; SYSTEM-ON-PACKAGE (SOP) MODULES;

POWER AMPLIFIERS;

EID: 35348856813     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.374075     Document Type: Conference Paper

References (19)

1. H. Kawanishi, Y. Yamauchi, N. Mineo, Y. Shibuya, H. Murai, K. Yamada, and H. Wada, "EAM-integrated DFB laser modules with more than 40-GHz bandwidth," IEEE Photon. Tech. Lett., Vol. 14 (2001), pp. 954-956.
2. Y. Akage, K. Kawano, S. Oku, R. Iga, H. Okamoto, Y. Miyamoto, and H. Takeuchi, "Wide bandwidth of over 50 GHz traveling-wave electrode electroabsorption modulator integrated DFB lasers," IEEE Electron. Lett., Vol. 37 (2001), pp. 299-300.
3. M. L. Pallec, C. Kazmierski, E. Vergnol, S. Perrin, J. G. Provost, P. Doussiere, G. Glastre, D. Carpentier, and S. Fabre, "New integrated buried laser-ridge modulator with identical active layer," IEEE Photon. Tech. Lett., Vol. 15 (2003), pp. 362-364.
4. R. N. Simons, G. E. Ponchak, "Modeling of Some Coplanar Waveguide Discontinuities,", IEEE Transactions on Microwave Theory and Tech., Vol. 36 (1998), pp. 1796-1803.
5. Dib N., Gupta M., Ponchak G., Katehi L., "Effects of ground equalization on the electrical performance of asymmetric CPW shunt stubs," IEEE MTT-S International, Vol. 2 (1993), pp. 701-704.
6. N. K. Das, "Methods of Suppression or Avoidance of Parallel-Plate Power Leakage from Conductor-Backed Transmission Lines,", IEEE Transactions on Microwave Theory and Techniques, Vol. 44 (1996), pp. 169-181.
7. H. S. Yoon, S. J. Kim, H. Y. Lee, "Suppression of Resonant Leakage Effects in Coplanar MMIC Packages Using a Silicon Submount Layer,", IEEE MTT-S International, Vol. 3 (2000), pp. 1337-1340.
8. L. A. Reith, J.W Mann, "Relaxed-Tolerance Optoelectronic Device Packaging", J. of Lightwave Technology, Vol. 9 (1991), pp. 477-484.
9. L. A. Reith, J.W Mann, "Single-mode fiber packaging for semiconductor optical devices", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 13 (1990), pp. 791-797.
10. M. Aoki, M. Komori, T. Tsuchiya, H. Sato, K. Nakahara, and K. Uomi, "InP-based reversed-mesa ridge-waveguide structure for high-performance long-wavelength laser diodes," IEEE J. Select. Topics Quantum Electron., Vol. 3 (1997), pp.672-683.
11. R.N. Simons, G.E. Ponchak, "Channelized Coplanar Waveguide: Discontinuities, Junctions, and Propagation Characteristics," IEEE MTT-S International, Vol. 3 (1989), pp.915-918.
12. A.A. Omar, Y.L. Chow, "Effect of Air-Bridges and Mitering on Coplanar Waveguide 90° Bends: Theory and Experiment" Microwave Symposium Digest, Vol. 2 (1996), pp. 823-826.
13. T.M. Weller, R.M. Henderson, "Optimization of MM-Wave Distribution Networks Using Silicon-Based CPW," Microwave Symposium Digest, Vol. 2 (1998), pp.7-12.
14. Zaidel S. A., Alcom T. S., "Process for making air bridges for integrated circuits,", United States Patent No. 5408742,1993.
15. J. Y. Park, J. H. Sim, et al., "Fabrication of thick silicon dioxide air-bridge for RF application using micromachining technology,", Proc of Microprocesses and Nanotechnology Conference, Oct. 2001, pp. 202-203.
16. Cole, Jr., Her bert S, et al., "Method for making an electronics module having air bridge protection without large area ablation,", United States Patent No. 5548099, 2001.
17. B. Gorowitz, C. A. Becker, et al., "Structure for protecting air bridges on semiconductor chips from damage,", United States PatentNo.5,757,072, 1998.
18. H. G. Yun, K. S. Choi, Y. H. Kwon, J. S. Choe, J. T. Moon, "Right-Angle-Bent CPW for the Application of the Driver-Amplifier- Integrated 40 Gbps TW-EML Module, ", ETRI J., Vol. 28 (2006), pp.648-651.
19. MAXIM High-Frequency/Fiber Communications Group, "NRZ Bandwidth - HF Cutoff vs. SNR," Application Note, HFAN-09.0.1 (Rev. 0, 12/01), pp. 1-5.