Right-angle-bent CPW for the application of the driver-amplifier-integrated 40 Gbps TW-EML module

ETRI Journal

Volumn 28, Issue 5, 2006, Pages 648-651

  Yun, Ho Gyeong ^a   Choi, Kwang Seong ^a   Kwon, Yong Hwan ^a   Choe, Joong Seon ^a   Moon, Jong Tae ^a   Lee, Myung Hyun ^a  

^a Electronics and Telecommunications Research Institute (ETRI)   (South Korea)

Author keywords

40 Gbps; Coplanar waveguide; Dielectric overlay; Wedge bonding

Indexed keywords

COMMUNICATION SYSTEMS; COMPUTER SIMULATION; DIELECTRIC MATERIALS; LASER BEAM EFFECTS; LIGHT AMPLIFIERS;

DIELECTRIC OVERLAY; DRIVER AMPLIFIER-INTEGRATED (DAI); WEDGE BONDING;

OPTICAL WAVEGUIDES;

EID: 33750088992     PISSN: 12256463     EISSN: 12256463     Source Type: Journal    
DOI: 10.4218/etrij.06.0206.0092     Document Type: Article

References (13)

1. Y.H. Kwon, et al., "Fabrication of 40 Gb/s Front-End Optical Receivers Using Spot-Size Converter Integrated Waveguide Photodiodes," ETRI J., vol. 27, 2005, pp. 484490.
2. H. Kawanishi, Y. Yamauchi, et al., "EAM-Integrated DFB Laser Modules with More than 40-GHz Bandwidth," IEEE Photonics Tech. Letters, vol. 13, 2001, pp. 954-956.
3. K.S. Choi, et al., "Optimization of Packaging Design of TWEAM Module for Digital and Analog Applications," ETRI J., vol. 26, 2004, pp. 589-596.
4. R.N. Simons, G.E. Ponchak, "Modeling of Some Coplanar Waveguide Discontinuities," IEEE Transactions on Microwave Theory and Tech., vol. 36, 1998, pp. 1796-1803.
5. A.A. Omar, Y.L. Chow, "Effect of Air-Bridges and Mitering on Coplanar Waveguide 90° Bends: Theory and Experiment," Microwave Symposium Digest, vol. 2, 1996, pp. 823-826.
6. T.M. Weller and RM. Henderson, "Optimization of MM-Wave Distribution Networks Using Silicon-Based CPW," Microwave Symposium Digest, vol. 2, 1998, pp.7-12.
7. R.N. Simons and G.E. Ponchak, "Channelized Coplanar Waveguide: Discontinuities, Junctions, and Propagation Characteristics," IEEE MTT-S International, vol. 3, 1989, pp.915-918.
8. P.M. Watson and K.C. Gupta, "EM-ANN Modelling and Optimal Chamfering of 90° CPW Bends with Air-Bridges," IEEE MTT-S International, vol. 3, 1997, pp.1603-1606.
9. S.A. Zaidel and T. and S. Alcorn, Process for Making Air Bridges for Integrated Circuits, US Patent 5408742, Martin Marietta Corporation, 1993.
10. J.Y. Park, J.H. Sim, et al., "Fabrication of Thick Silicon Dioxide Air-Bridge for RF Application Using Micromachining Technology," Microprocesses and Nanotechnology Conf., 2001, pp. 202-203.
11. H.S. Cole Jr., et al., Method for Making an Electronics Module Having Air Bridge Protection without Large Area Ablation, US Patent 5548099, Martin Marietta Corporation, 2001.
12. B. Gorowitz, C.A. Becker, et al., Structure for Protecting Air Bridges on Semiconductor Chips from Damage, US Patent 5,757,072, Martin Marietta Corporation, 1998.
13. MAXIM High-Frequency/Fiber Communications Group, NRZ Bandwidth - HF Cutoff vs. SNR, Application Note, HFAN-09.0.1 (Rev. 0, 12/01), Dec. 2001, pp. 1-5.