Assessment of vacuum lifetime in nL-packages

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

Volumn 1, Issue , 2005, Pages 225-230

  Reinert, Wolfgang ^a   Kähler, Dirk ^a   Longoni, Giorgio ^b  

^a FRAUNHOFER INSTITUTE FOR SILICON TECHNOLOGY ISIT   (Germany)

^b SAES GETTERS S P A   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

CAVITY RESONATORS; ENVIRONMENTAL IMPACT; HERMETIC DEVICES; MICROSENSORS; THIN FILMS; VACUUM APPLICATIONS;

ENVIRONMENTAL STRESSES; LEAK TESTING; QUALITY FACTOR MONITORING;

CHIP SCALE PACKAGES;

EID: 33847265424     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. W. Reinert et al., "Vacuum Wafer Bonding Technology", IMAPS Nordic 2004
2. M. Nese et al., "New method for testing hermeticity of silicon sensor structures", Sensors and Actuators A, 1996, Vol. 53,p.349-352
3. M. Moraja et al., "Impact of cleaning procedures on getter films", Proceeding of SPIE Vol.5343 (2004) p. 87-93
4. Wolfgang Reinert, Dr. Dirk Kähler, Marten Oldsen, Dr. Peter Merz, "IN-LINE CRITICAL LEAK RATE TESTING OF VACUUM-SEALED AND BACK-FILLED RESONATING MEMS DEVICES", 8th international symposium on semiconductor wafer bonding, May 15-20 2005, Quebec
5. Max Wutz, Hermann Adam, Wilhelm Walcher, Theorie und Praxis der Vakuumtechnik, 1988, Friedr. Vieweg & Sohn, Braunschweig