Solid-state microchip laser bonding by a low temperature epoxy-free and flux-less process

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2005, Pages 1711-1715

  Kopp, Christophe ^a   Gilbert, Karen ^a  

^a CEA LETI   (France)

Author keywords

[No Author keywords available]

Indexed keywords

GAS FLUXING; INTERDIFFUSION BONDING; SOLID-STATE MICORCHIP LASER BONDING; THERMAL AGEING;

AGE HARDENING; DIFFUSION; HEAT TREATMENT; HEATING; INDIUM; LASER BEAMS; LOW TEMPERATURE PHENOMENA; MICROPROCESSOR CHIPS; OPTOELECTRONIC DEVICES; QUARTZ; SEALING (CLOSING); SEMICONDUCTOR LASERS; SOLDERING;

SOLID STATE DEVICE STRUCTURES;

EID: 24644490922     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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