Next generation low stress plastic cavity package for sensor applications

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

Volumn 1, Issue , 2005, Pages 231-237

  Zimmerman, Michael ^a   Felton, Larry ^b   Lacsamana, Elmer ^b   Navarro, Ramon ^b  

^a Quantum Leap Packaging   (United States)

^b ANALOG DEVICES INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INERTIAL SENSORS; OVERMOLDED PACKAGES; PACKAGE STRESS; THERMAL STRAINS;

CAVITY RESONATORS; CERAMIC MATERIALS; GYROSCOPES; METAL MOLDING; MICROELECTROMECHANICAL DEVICES; MICROSENSORS;

CHIP SCALE PACKAGES;

EID: 33847329243     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. Chemical Market Reporter, July 5, 1999, Alex Tullo.
2. JEDEC standard Document, Thermally Enhanced Plastic Very Thin and Very Very Thin Fine Pitch Quad Flat No Lead Package. HVF-PQFN, HWF-QFN. Item 11.11-684. MO-220-I.