A multi-layer plastic packaging technology for miniaturized bio analysis systems containing integrated electrical and mechanical functionality

2nd Annual International IEEE-EMBS Special Topic Conference on Microtechnologies in Medicine and Biology - Proceedings

Volumn , Issue , 2002, Pages 66-70

  Han, A ^a   Wang, O ^a   Mohanty, S K ^a   Graff, M ^a   Frazier, B ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Bio MEMS; Microfluidics; Packaging

Indexed keywords

PACKAGING;

ELECTRICAL COMPONENTS; HOT-EMBOSSING; INTERCONNECT TECHNOLOGY; MECHANICAL FUNCTIONALITY; MEMS FABRICATION TECHNIQUES; MICRO FLUIDIC SYSTEM; MULTIPLE MATERIALS; PLASTIC PACKAGING;

MICROFLUIDICS;

EID: 84964587744     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MMB.2002.1002266     Document Type: Conference Paper

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